Quantification of the mechanical strength of thermally reduced graphene oxide layers on flexible substrates

This paper proposes a method to characterize the failure modes of rGO(1)-based devices using a controlled peel test. Analysis of the detached rGO particles from the substrate during testing was performed with an image processing technique and results were used to create a mathematical model quantifying the cohesion and adhesion failure energies. Partial failure energies were calculated based on percentage of rGO particles detached from the substrate so that the higher detachment percentage the lower failure energies. The model was applied to an array of tests on samples made with different GO concentrations, preparations, and treatments.