A New Design Approach of SoP and Its Design Flow
2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)(2020)
摘要
This paper proposes to combine flexible SoC technology (called as Silicon on Polymer, SoP) with NOC technology. In this approach, the communication problem of SoP can be solved. However, the physical change of flexible materials will lead to the change of electrical properties. This paper presents the design flow of Flexible NoC which includes physical design and electrical design, to solve the problem. Since the design of SOPs needs to meet the requirements of flexibility first, and then consider the electrical characteristics, the paper presents a deign flow to explore the flexible NoC structure which have the best flexible performance. On the base of physical design, this paper gives the way to evaluate the electrical performance. Interconnection delay is one of the most important design values. Finally, based on the proposed flow, the simulation results of each stage and the corresponding discussion are given.
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关键词
SoP,design flow,flexible SoC technology,NOC technology,communication problem,flexible materials,electrical properties,electrical design,electrical characteristics,deign flow,flexible NoC structure,flexible performance,electrical performance,Silicon on Polymer,interconnection delay
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