Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

Thiago Soares,Clarissa Cruz,Marcella Xavier,Rodrigo V. Reyes,Felipe Bertelli,Amauri Garcia,José E. Spinelli,Noé Cheung

Journal of Alloys and Compounds（2021）

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摘要

•A Bi-Sb lead-free alloy has been solidified against three substrates: Cu, Ni and Steel.•A proposed thermal/experimental approach has analyzed solder/substrates interaction.•Experimental solidification thermal history gives supports to the approach.•The wettability has shown not be the main factor controlling heat extraction.

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关键词

Bi-Sb alloy,Heat transfer,Solidification,Microstructure,Interface

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