Discrete Integrated Circuit Electronics (DICE)

2020 IEEE High Performance Extreme Computing Conference (HPEC)(2020)

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摘要
We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.
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关键词
Automated assembly,additive manufacturing,chiplets,system integration,machine learning,high-performance computing
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