RFIC and RF Module for 5G Applications

2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)（2020）

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摘要

In this work, a 12nm CMOS 2/3/4/5G multi-RAT (Radio Access Technology) XCVR is presented, capable of supporting up to 6 inter-band CA DL with flexible 4x4 MIMO port selection and 2 inter-band CA UL with coherent 2x2 MIMO. In NR 200MHz 4x4 MIMO 256QAM mode a throughput up to 5Gbps can be achieved. This work is housed in 2-layer Flip-Chip Chip-Scale Package (FCCSP).

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关键词

flexible 4x4 MIMO port selection,2 inter-band CA UL,coherent 2x2 MIMO,throughput up to 5Gbps,5G applications,Radio Access Technology,6 inter-band CA DL,2-layer flip-chip chip-scale package,4x4 MIMO 256QAM mode,size 12.0 nm,frequency 200.0 MHz

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