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Condition monitoring for the Binder Jetting AM-process with machine learning approaches

2020 IEEE Conference on Industrial Cyberphysical Systems (ICPS)(2020)

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摘要
Binder jetting is an Additive manufacturing process of increasing industrial importance. The printhead performance is largely responsible for the component properties. A reliable and simple analysis tool is missing for this. This article shows the first results of the application of a measurement method based on camera images that does not require reference images.
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关键词
condition monitoring,image analysis,binder jetting
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