Condition monitoring for the Binder Jetting AM-process with machine learning approaches
2020 IEEE Conference on Industrial Cyberphysical Systems (ICPS)(2020)
摘要
Binder jetting is an Additive manufacturing process of increasing industrial importance. The printhead performance is largely responsible for the component properties. A reliable and simple analysis tool is missing for this. This article shows the first results of the application of a measurement method based on camera images that does not require reference images.
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关键词
condition monitoring,image analysis,binder jetting
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