Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)（2020）
Key words
device wafer,thermal stability,high vacuum survivability,advanced packaging integration processes,thermal simulation test,bond line,high vacuum conditions,laser ablation,system-in-packaging,package-on-package,heterogeneous integration applications,thinned wafer integration,advanced packaging applications,laser releasable temporary bonding adhesives,PECVD,Ti-Cu,SiO2
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined