Electrooptic Measurements to Assess the Quality of Calibration Kit Design
IEEE Microwave and Wireless Components Letters(2021)
摘要
Electromagnetic coupling between planar devices can degrade microwave calibrations and, consequently, the accuracy of a measurement. This letter describes measurement-based methods that can identify, assess, and visualize the electric field coupled between the adjacent planar calibration structures. The coupling within a printed circuit board (PCB)-based and an on-wafer impedance standard substrate is successfully demonstrated and analyzed up to 4 and 20 GHz, respectively, through S-parameter and electric-field measurements obtained using an electrooptic probing system.
更多查看译文
关键词
Calibration,coupling,electrooptic (EO),microwave measurement,on-wafer
AI 理解论文
溯源树
样例
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要