Electrooptic Measurements to Assess the Quality of Calibration Kit Design

IEEE Microwave and Wireless Components Letters(2021)

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摘要
Electromagnetic coupling between planar devices can degrade microwave calibrations and, consequently, the accuracy of a measurement. This letter describes measurement-based methods that can identify, assess, and visualize the electric field coupled between the adjacent planar calibration structures. The coupling within a printed circuit board (PCB)-based and an on-wafer impedance standard substrate is successfully demonstrated and analyzed up to 4 and 20 GHz, respectively, through S-parameter and electric-field measurements obtained using an electrooptic probing system.
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关键词
Calibration,coupling,electrooptic (EO),microwave measurement,on-wafer
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