Improved Air Spacer Co-Integrated With Self-Aligned Contact (Sac) And Contact Over Active Gate (Coag) For Highly Scaled Cmos Technology

2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY(2020)

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摘要
We report an improved air spacer that is successfully cointegrated on FinFET transistors with Self-Aligned Contacts (SAC) and Contacts Over Active Gate (COAG). The new integration scheme enables air spacer founation agnostic to the underlying transistor architecture, thus paving the way for a seamless adoption of air spacer in FinFET and Gate-All-Around (GAA) technologies. A reduction in effective capacitance (C-eff) by 15% is experimentally demonstrated. The power/performance benefits achieved by the new air spacer exceeds the benefits of scaling FinFET from 7nm node to 5nm node.
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关键词
contact over active gate,gate-all-around technologies,effective capacitance,SAC,self-aligned contact,improved air spacer,highly scaled CMOS technology,COAG,FinFET transistors,size 5.0 nm
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