Improved Air Spacer Co-Integrated With Self-Aligned Contact (Sac) And Contact Over Active Gate (Coag) For Highly Scaled Cmos Technology
2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY(2020)
摘要
We report an improved air spacer that is successfully cointegrated on FinFET transistors with Self-Aligned Contacts (SAC) and Contacts Over Active Gate (COAG). The new integration scheme enables air spacer founation agnostic to the underlying transistor architecture, thus paving the way for a seamless adoption of air spacer in FinFET and Gate-All-Around (GAA) technologies. A reduction in effective capacitance (C-eff) by 15% is experimentally demonstrated. The power/performance benefits achieved by the new air spacer exceeds the benefits of scaling FinFET from 7nm node to 5nm node.
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关键词
contact over active gate,gate-all-around technologies,effective capacitance,SAC,self-aligned contact,improved air spacer,highly scaled CMOS technology,COAG,FinFET transistors,size 5.0 nm
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