3d Heterogeneous Package Integration Of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter With Backside Power Delivery Network

Xiao Sun,Hesheng Lin,Dimitrios Velenis,John Slabbekoorn,Giacomo Talmelli,Pieter Bex,Tom Sterken,Rudy Lauwereins,Christoph Adelmann,Andy Miller,Geert Van der Plas,Eric Beyne

2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY（2020）

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摘要

We demonstrate a novel concept of integrating 110-mu m-thick low-resistance high-Q magnetic core inductors in fan-out wafer level packaging (FOWLP). Unlike thin-film magnetic core inductors [1], this solution offers the possibility to embed thick cores to meet power density requirements, allowing for 89% efficiency at 1.2 W/mm(2) power density for 2:1 power conversion with a backside power delivery network (BSPDN) using circular-shaped magnetic inductors.

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关键词

backside power delivery network,circular-shaped magnetic inductors,3d heterogeneous package integration,high-Q magnetic core inductors,fan-out wafer level packaging,thin-film magnetic core inductors,power density requirements,efficiency buck converter

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