Fabrication of a Micro Vertical Probe for Semiconductor Circuits Inspection

With the development of technology, semiconductor components are now being used in many parts of IT components and solar modules. Because of the features of these products, a device for inspecting the manufactured products is needed. In this paper, we present a method of manufacturing a probe for use in testing semiconductor-based products. As a feature of semiconductor-based inspection probes, physical contact occurs on the wafer, which is the basis of semiconductor products, and shape changes can occur due to overdrive. Therefore, if the spring-back design is not used properly, a problem incompatible with the design may occur. In order to solve this problem, we selected the design factors for each probe position. In addition, tensile tests as well as microstructure, and mold roughness measurements were performed using finite element analyses after which the measured data were applied. Based on the parameters selected for the Taguchi experimental design, we propose designs for the production of a vertical probe. Finally, we analyzed the actual molds produced through the design and the results of the vertical probes produced through the application of the results of this research.