Enhanced Simulation Methodology For High-Speed Data Center Application

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)(2020)

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Abstract
Comparisons among commonly used EDA tools[]-[] are demonstrated, simulations are conducted on a simple but canonical low-loss test coupon. Then HSIO routings on a real design PCB using same material, including long via-stub and short via-stub nets, are used to test the reliability of simulation near via and breakout region. In our experiments, hybrid simulation is highly recommended to better covering the electromagnetic effect beyond 15 GHz and finishing jobs in a reasonable time. All the simulation results are compared with measurement result and simulation time is recorded to compare the accuracy and efficiency. A comprehensive summary table is provided to compare these EDA tools used in this experiment.
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Key words
enhanced simulation methodology,high-speed data center,EDA tools,low-loss test coupon,HSIO routings,short via-stub nets,hybrid simulation,electromagnetic effect,simulation time,real design PCB,frequency 15.0 GHz
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