Tensile, hardness and microstructural properties of Sn-Pb solder alloys

This work investigated the Tensile, Hardness and Microstructural Properties of Sn-Pb Solder Alloys of Pb content 15, 60 and 80%. The Sn-Pb solder alloy was prepared from granulated Sn and Pb. The element was mixed in right proportions, melted in furnace at 350 ?C while being held in crucible. The results showed that maximum tensile stresses obtained had specimen containing 60% with the highest value and the alloys had decreased hardness as a result of increased Pb content while ductility of the alloy increased as observed from stress strain curve. The sample alloy with 60% Pb is the preferred solder. ? 2021 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the International Conference on Materials, Processing & Characterization.