High Temperature Electromagnetic Shielding Shape Memory Polymer Composite

High temperature electromagnetic shielding materials that can eliminate electromagnetic interference (EMI) and withstand high temperature have vast potential in cutting-edge applications like aircraft, and here electromagnetic shielding shape memory polyimide (EMSMPI) is reported for the first time. EMSMPI is synthesized by incorporating 5% short carbon fiber and 4% carbon black into shape memory polyimide matrix, its glass transition temperature of 308 degrees C is higher than other electromagnetic shielding polymers, and it can hang the kettle 43,000 times heavier than itself. The 0.35 mm thick EMSMPI film exhibits nice shielding effects with average EMI shielding effectiveness of 23.9 dB in X-band, and its shielding mechanism is discussed. Shape processability of EMSMPI endowed by shape memory effect is valuable for sophisticated devices as it can be processed into different shapes conveniently, and shielding effectiveness after thirty cycles is still higher than the recommended limit of 20 dB for commercial applications.