Design, Fabrication And Characterization Of A Q-Band Patch Antenna Integrated On Stacked Interposers
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)(2020)
摘要
In this study, we present a Q-band patch antenna with an underling cavity integrated on the stacked high-resistivity Si interposers. A process is developed and sample is fabricated. Evaluation is done and the measurement results shows that it has an operating frequency of 32.75GHz, a -10dB bandwidth of 1.04GHz, a maximum gain of 3dB. Those results prove the feasibility of integrating high-frequency antennas with TSV interposer preliminary.
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关键词
Antenna in Package, TSV, Patch Antenna, Cavity, Q-band, Broadband, Silicon Interposer
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