Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop
International Journal of Heat and Mass Transfer(2020)
摘要
•New open manifold microchannel heat sink for high heat flux electronics cooling.•Open modification reduces pressure drop by 25 % with comparable thermal performance.•3D conjugate heat transfer model of a fully resolved manifold microchannel heat sink.•Flow uniformity critical to thermal performance, stagnation at higher flow rates.
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关键词
Manifold,Microchannel,Electronics cooling,Heat sink,Jet impingement
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