Silicon Photonic 2.5d Integrated Multi-Chip Module Receiver
2020 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)（2020）
Abstract
We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers. (C) 2020 The Author(s)
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Key words
silicon photonic 2.5D integrated multichip,wavelength division multiplexing,silicon photonic receiver,multichip module,silicon interposer,four-channel photonic cascaded microdisk receiver,Si
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