Silicon Photonic 2.5d Integrated Multi-Chip Module Receiver

Nathan C. Abrams,Qixiang Cheng,Madeleine Glick,Moises Jezzini,Padraic Morrissey,Peter O'Brien,Keren Bergman

2020 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)（2020）

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摘要

We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers. (C) 2020 The Author(s)

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关键词

silicon photonic 2.5D integrated multichip,wavelength division multiplexing,silicon photonic receiver,multichip module,silicon interposer,four-channel photonic cascaded microdisk receiver,Si

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