Demonstration Of A Collective Hybrid Die-To-Wafer Integration

Samuel Suhard,Alain Phommahaxay,Koen Kennes,Pieter Bex,Ferenc Fodor,Maarten Liebens,John Slabbekoorn,Andy Miller,Gerald Beyer,Eric Beyne

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)（2020）

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摘要

In this paper, a collective hybrid bonding of a die to wafer is demonstrated. The key integration steps such as CMP, wet etch, cleaning, defect metrology, alignment optimization in die to wafer and wafer to wafer bonding tools are discussed in detail. Finally void free Cu to Cu and SiCN-SiCN connection is shown in this paper. Promising electrical yield more than 85% is obtained for the daisy chains containing 219 pad connections.

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关键词

Die to wafer, collective hybrid bonding, wafer to wafer bonding

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