Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology(2020)

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摘要
In this article, we cover the fundamentals of neural networks and Bayesian learning with a focus on signal and power integrity problems arising in packaging. Rather than only focus on mathematical formulations, we explain the important concepts and the intuition behind them, thereby demystifying the use of machine learning for these problems. We also share some of the recent developments in this area along with future research directions in the context of packaging. Links to open-source downloadable software for some of the methods discussed are also provided.
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关键词
Bayesian learning,behavioral modeling,design optimization,neural networks,signal and power integrity (SI/PI),surrogate modeling
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