Drop performance simulation for packages of wireless electronic products

A finite element modeling procedure is developed to simulate the drop performance for packages of wireless electronic products. Impact behaviors of polymer packaging materials are characterized and a nonlinear, rate dependent material model is established. An instrumented drop test system is developed for validation testing of the simulation procedure. The drop simulation can provide valuable data to identify possible impact failures of a newly designed package. It can also be used for investigation of drop failures of existing products. The developed procedure is proven to be useful in establishing design criteria for electronic packages with maximum survivability.