High bandwidth density optically interconnected Terabit/s Boards
Proceedings of SPIE(2018)
Abstract
Within the European Project TERABOARD, a photonic integration platforms including electronic-photonic integration is developed to demonstrate high bandwidth high-density modules and to demonstrate cost and energy cost target objectives. Large count high bandwidth density EO interfaces for onboard and intra-data center interconnection are reported. For onboard large count interconnections a novel concept based on optical-TSV interconnection platform with no intersections and no WDM multiplexing is reported. All input/output coupler arrays based on a pluggable silica platform are reported as well.
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Key words
3D Integration,Interconnection,Data center,PIC,Silica waveguides,Silicon photonics
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