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Comparison of a Cu-UBM versus Co-UBM for Sn flip chip bumps

R Labie,P Ratchev,E Beyne

Electronic Components and Technology Conference（2005）

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Abstract
In this paper, pure Sri bumps are considered as Pb-free solder alternative. The thermal-cycling reliability of Sn is investigated for two different UBM materials: Cu and Co. A lifetime improvement of 40% is found for the Co-system. This can be explained by a change in failure mechanism: while Cu-Sn samples show a mixed failure mechanism of ductile shear through solder and brittle fracture at the intermetallic interface, the Co-Sn samples are characterized by dominant solder fatigue.
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