Search
ChatPaper
AI Writing
analysis
Analysis
编组
Open Data
more
More
RankingsMust ReadingJournal&ConferenceAI TRAI HistoryMaster Reading TreeXiaomai's Star TalentsTrajectoryTalentNDI TrackerOpenAI sign Language
VIPCreated with Sketch.

降温速率对Bi-2223/AgAu带材微观结构和传输性能的影响

Ma Xiaobo,Zhang Shengnan,Yu Zeming,Liu Guoqing,Jiao Lei,Zheng Hui-ling,Li Chengshan,Zhang Pingxiang,Li Jinshan

RARE METAL MATERIALS AND ENGINEERING（2019）

Cited 0|Views5
No score
Abstract
采用PIT工艺制备了单芯Bi-2223/AgAu带材,系统地研究了第二次热处理阶段(HT2)降温速率对带材相组成、微观结构和传输性能的影响.结果 表明:随着降温速率的减小,富铅相3321不断增加,CuO颗粒尺寸逐渐增大.当冷却速率从600℃/h减小到1℃/h时,临界电流密度Jc从7 kA/cm2增加到11.5 kA/cm2,增加了64％.由于晶间连接性能和磁通钉扎性能的提高,在较低的降温速率下,Bi-2223/AgAu带材在磁场下的临界电流密度也得到了提高.
More
Translated text
Key words
high temperature superconductor,(Bi, Pb)-2223/AgAu tapes,cooling rate,microstructure,critical current density
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined