Properties of Al Film on Composite with Ti Interlayer

The composites, such as CFRP and GFRP, have been widely applied in spaceflight. In this work, we deposited Al film with Ti interlayer on composites by cathodic arc deposition technology, and the composites would behave as metal with light mass. The properties of Ti/A1 films were analyzed by SEM, XRD, Dektak 8 Stylus Profilometer, Z-82 standard four probe and pull test apparatus (CMT-6104). The results show that the film adhesion is strengthened for the chemical bond, such as Ti-C, Ti-O, is created at interlayer in film deposition process, and the electrical properties of Al film is close to that of bulk aluminum.