An automated assessment method for integrated circuit chip detachment from printed circuit board by multistep binarization and template matching of X-ray transmission images (Nov, 10.1007/s10163-020-01131-1, 2020)

Given the increase in digital product waste, demand for recycling of printed circuit boards (PCBs) is increasing. Precious and minor metals are often well concentrated in integrated circuit (IC) chips, especially in PCBs; hence, IC chips are primary targets for recycling. The technology for the non-destructive detachment of IC chips from PCBs is increasing in sophistication; however, the effectiveness of IC chip detachment is currently assessed manually and visually. In the present study, an automated IC chip detachment assessment method was developed, which combines multistep binarization and template matching of X-ray transmission images of crushed PCBs. To validate the method, five types of mechanically crushed PCBs from mobile phones were examined, and the developed method successfully assessed the IC chip detachment rate, with an average error rate of only 2.2% compared to visual assessment.