Studies on Maleimide Functionalized Phenolic Resin

Resole type phenolic resin (PF) based on p-tert octylphenol is prepared using molar excess of formaldehyde in basic medium. The synthesized phenolic resin is functionalized with maleimide groups (MPF) and is thermally polymerized at 270 degrees C. These materials are investigated using FTIR, (HNMR)-H-1 and DSC. The maleimide functionalized PF resin shows higher curing temperature. The thermo gravimetric analysis of the materials show that the polymerized maleimide functionalized phenolic resins has higher thermal stability than other materials investigated. The activation energy for the different stages of degradation of PF resin, MPF and poly MPF are calculated and the results are discussed.