Correlation Between the Formation of Particle Defects on Sputtered Cu Seed Layers and Cu Targets
Micro & Nano Letters（2019）
Key words
X-ray photoelectron spectra,impurities,copper,metallic thin films,carbon,sputter deposition,semiconductor device metallisation,particle defects,carbon particle number,sputtered Cu seed layers,advanced copper interconnection applications,liquid particle counter detection system,impurity particles,X-ray photoelectron spectroscopy,Cu
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