TSV-assisted Hybrid FinFET CMOS - Silicon Photonics Technology for High Density Optical I/O

We demonstrate ultra-compact, low-power 40 Gbps NRZ (single-lane) transmitter and receiver functionality in a hybrid 14 nm FinFET CMOS-silicon photonics (SiPh) interposer technology platform. The transceivers are fully powered and controlled through SiPh integrated TSVs and micro-bumps, paving the way for future ultra-dense multi-channel Tb/s co-packaged optics.