Accelerated wetting transition from hydrophilic to hydrophobic of sputtered Cu films with micro-scale patterns

•Metallic Cu films were prepared by DC magnetron sputtering.•Micro-square holes were fabricated using lithography technique.•Wetting transition from hydrophilic to hydrophobic was accelerated with patterns.•Stable wetting on patterned Cu films was in Cassie-Baxter state.