Study On Chip Component No-Fillet Solder Joint Stress And Strain Under Three Point Bending

a three-point bending stress-strain finite element analysis model of the chip component no-fillet solder joint was established. The pad length, pad width, stencil thickness and solder joint material were analyzed for the solder joint bending under three bending loading conditions. The effect of stress and strain. The results show that under the condition of three-point bending loading, the maximum bending stress strain of the chip component no-fillet solder joint increases with the width of the pad under the premise of changing the pad length, pad width and stencil thickness. Increase, decrease with the length of the pad and the thickness of the stencil; for the four solders Sn63Pb37, Sn62Pb36Ag2, SAC305 and SAC387, the bending stress strain in the no-fillet solder of SAC387 material is the largest, and the Sn62Pb36Ag2 material is not welded. The bending stress strain in the seam weld is minimal.