Effect of Structural Parameters of Substrate Integrated Waveguide on S-parameter Based on HFSS

2019 20th International Conference on Electronic Packaging Technology(ICEPT)(2019)

引用 1|浏览2
暂无评分
摘要
Substrate integrated waveguides (SIW) are widely used in high-speed interconnection technology and it realize high rate data transmission. In this paper, the software of HFSS is used for modeling and simulation of SIW, and the influence of SIW structure parameters on S-parameter is analyzed. Through orthogonal experimental, the main factors which affect S-parameter are obtained. The results show that S 11 increases with the increase of the diameter d of the metal through-hole. S 11 increases with the increase of metal through hole spacing; S 11 decreases with the increase of width of SIW. Metal through hole spacing has a significant influence on S-parameter (S 11 ), which is the main factor affecting s-parameter (S 11 ).
更多
查看译文
关键词
substrate integrated waveguide,high speed interconnection technology,data transmission,S-parameter,Orthogonal experimental
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要