The Study on Failure Analysis of the Common Conformal Coating

Zhang Yingjie, Chen Bin,Xu Huanxiang, Lai Chunchao,Liu Zilian

2019 20th International Conference on Electronic Packaging Technology(ICEPT)(2019)

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摘要
As the coatings on a printed circuit production, conformal coatings play a role to isolate electronic components and circuit substrates from the hostile environment. And conformal coatings with excellent performance can significantly improve the life of electronic products. However, due to the uneven quality of conformal coatings on the market, or because of the unclear application conditions, it may cause the wrong application, which leading to the coatings discoloration, cracking, bubbles, peeling, falling off and other phenomena in a short time, and then making the circuit board corrosion, electromigration and sulfation. This paper will analyze and summarize the common failure phenomena of conformal coatings through some engineering cases.
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关键词
conformal coating,failure phenomena,corrosion,electromigration,sulfation
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