Design, fabrication and measurement of TSV interposer integrated X-band microstrip filter

Yunheng Sun,Yufeng Jin,Han Cai,Shenglin Ma,Liulin Hu,Shuwei He

2019 20th International Conference on Electronic Packaging Technology(ICEPT)（2019）

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摘要

In this paper, we present a TSV interposer integrated X-band microstrip filter. It designed as working at X band with an insertion loss (IL) of 2.2dB, measuring 2.8mm×3.7mm in size. With processed sample, the measured bandwidth (BW) is about 2.33GHz, the passband insertion loss is about 2.2dB.

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关键词

TSV,interdigital filter,X band,insertion loss

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