Cu@Ag nanoparticles doped micron-sized Ag plates for conductive adhesive with enhanced conductivity

Cu@Ag nanoparticles were synthesized to act as a doping conductive filler for micron-sized Ag plates as conductive adhesive. Because of the defect for conductive channels of Ag plates-based conductive adhesive, it is highly desirable to remove the defect to improve the conductivity. The synthesized Cu@Ag nanoparticles, prepared via a wet-chemical method, were found to enhance the conductivity and tensile strength of a Ag plates-based conductive adhesive. The volume resistivity of a Cu@Ag nanoparticle doped Ag plate-based conductive adhesive can be reduced to 2.0 × 10−6 Ω m, and the tensile strength of the conductive adhesive can reach 16 MPa, revealing their great potential for practical application.