Dielectric Properties of Cu/Epoxy Random Composites at Radio-Frequency Range

Cu/epoxy composites with the different volume fraction of Cu were prepared through hot press process. The conductivity and dielectric properties of the Cu/epoxy composite were investigated. The analyze of the results indicated that the real part of permittivity \( \varepsilon _{r}^{{\prime }} \) of Cu/epoxy composites increased when copper content increased, which is caused by the increasing interface connect between Cu fillers and epoxy partials. The frequency dispersions of ac conductivity follow the power law and thus indicates the hopping conduction behavior in composites.