Reliability Stressing Control Using Jacobian Feedback Kelvin Measurement On Intel Technologies

In the Intel reliability stress lab, various transistor testing methodologies are being developed to meet the evolving requirements of new Intel technologies. To better control for voltage drop in metal routing, MOSFETs structures used for reliability tests such as hot carrier injection (HCI) or bias temperature instability (BTI), have evolved from 4 terminals to 6 terminals to enable Kelvin-style testing. In this work, a software-based Kelvin Measurement using Jacobian feedback control theory is developed providing great flexibility on different test structures and optimize use of existing SMU channels. Details are presented for Jacobian Feedback Kelvin Measurements (JFKM) on voltage control, examples of types of test issues, and the measures to improve the convergence of the feedback loop. With a thorough study of JFKM, a high level of data accuracy has been maintained while tool flexibility and throughput have been maximized.