Heat Transfer Performance of Microgroove Back Plate Heat Pipes with Working Fluid and Heating Power

Micro heat pipes (MHP) cooling is one of the most efficient solutions to radiate heat for high heat flux electronic components in data centers. It is necessary to improve heat transfer performance of microgroove back plate heat pipes. This paper discusses about influence on thermal resistance through experiments and numerical simulation with different working fluids, filling ratio and heat power. Thermal resistance of the CO 2 filled heat pipe is 14.8% lower than the acetone filled heat pipe. In the meantime, at the best filling ratio of 40%, the CO 2 filled heat pipe has the optimal heat transfer behavior with the smallest thermal resistance of 0.123 K/W. The thermal resistance continues to decline but the magnitude of decreases is going to be minor. In addition, this paper illustrates methods about how to enhance heat pipe performance from working fluids, filling ratio and heat power, which provides a theoretical basis for practical applications.