Chapter 2 3 D Packaging Architectures and Assembly Process Design

2D Two dimensional 3D Three dimensional BEOL Back end of line BI Burn-In CMP Chemical mechanical polishing D2D Die-to-die D2W Die-to-wafer ECD Electro-chemical deposition ECG Deleted in chapter EMIB Embedded multi-die interconnect bridge FEOL Front end of line IP Intellectual property KGD Known good die KOZ Keep out zone MCM Multi chip module MCP Multi chip package MEOL Middle end of line MPM Multi package module PECVD Plasma enhanced chemical vapor deposition PVD Plasma vapor deposition Rx Receiver SBS Side by side