THAI MULIATO AT DIA MAMMATION MATI US 009903020 B 2 ( 12 ) United States Patent

CN CN 1375575 10 / 2002 1412861 A 4 / 2003 ( Continued ) ( 73 ) Assignee : Applied Materials , Inc . , Santa Clara , CA ( US ) OTHER PUBLICATIONS ( * ) Notice : Subject to any disclaimer , the term of this patent is extended or adjusted under 35 U . S . C . 154 ( b ) by 349 days . Derwent 2006 065772 , Formation of multilayer enscapulating film over substrate , e . g . displace device , comprising delivering mixture precursors and hydrogen gas into substrate processing system , 2006 . ( Continued ) ( 21 ) Appl . No . : 14 / 486 , 105