Modeling for electronic packaging at apl

In the expanding world of modern electronics and integrated circuits, the need for high-density, highperformance electronic circuit packaging is paramount. Key to any successful electronic packaging activity is the ability to model and analyze electrical, mechanical, and thermal system behavior before actual system design and fabrication. Details of an APL-developed set of computer-based models that allow the design and performance verification (electrical, mechanical, and thermal) of complex, high-speed (lOO-MHz clocks) digital circuits are described and applied to a high-performance radar signal processing circuit.