11.7 Building Resistant Systems: From Temperature Awareness to Attack Resistance

This session explores new methods in building reliable and secure systems, especially in larger SoCs. Temperature-induced stress can impact the reliability of digital systems. Temperature fluctuations can also be exploited as side channels. This session first explores the two side of this coin by discussing a novel temperature-aware chiplet placing algorithm in 2.5D systems and by showing how transmission bandwidth encoded as a temperature signal can be maximized. Then, the rest of the session highlights advances in PUFs that are resistant against lastest-generation attacks, and particularly integration of PUFs in larger systems.