Pulse energy packing effects on material transport during laser processing of <1|1|1> silicon

The effects of energy pulse packing on material transport during single-pulse laser processing of <1|1|1> silicon is studied using temporarily shaped pulses with durations from 50 to 150 ns. Six regimes of material transport were identified and disambiguated through energy packing considerations over a range of pulse durations. Energy packing has been shown to shift the interaction to energetically costlier regimes without appreciable benefit in either depth, material removal or crater morphology and quality.