Chemical action in CMP 304 stainless steel based on hydrogen peroxide slurry 1

The 304 stainless steel material has become one of the flexible display substrates. Chemical mechanical polishing (CMP) will be one of the most practical machining technologies to achieve super-smooth and damage free on the material surface of stainless steel. The CMP slurry is one of the most important parts in CMP. The oxidant and pH regulator are the most important substances in polishing slurry. So, in this paper, the influence of the content of oxidant the hydrogen peroxide, the pH value and the pH regulator on the material removal rate (MRR) and surface roughness had been studied, respectively, by experiment and analysis. The results show, that the material removal rate and surface quality obtained in the acidic environment were higher than that of in the alkaline environment in CMP 304 stainless steel. The nitric acid and the sodium hydroxide as pH regulator, when used alone in slurry had strong oxidizing, and could increase the material removal rate and improved surface quality. The hydrogen peroxide had a strong oxidation resistance and the action of electrochemical corrosion, and also can produce Fenton type HaberWeiss reaction with the stainless steel base material, so it could achieve the removal of materials. In the six kinds of pH regulators, the material removal rate reaches maximum value when using the oxalic acid as the pH regulators at pH=2. These research results in this paper can provide a reference for further research the polishing slurry on CMP stainless steel.