Silicon Photonic Multi-Chip Module Interconnects for Disaggregated Data Centers

2020 International Conference on Optical Network Design and Modeling (ONDM)(2020)

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摘要
We present our development of 2.5D integrated multi chip module silicon photonic transceivers for disaggregated applications, such as big data and machine learning algorithms. Disaggregation of data center resources to improve application efficiency and performance can be achieved through photonic switching networks. Our four-channel transceiver provides the electro-optic interface between electrical data generation and photonic switching to enable disaggregation within data centers.
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关键词
Silicon Photonics,Multi-Chip Module,Interposer,2.5D Integration,Optical Interconnects,Disaggregation
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