Design And Fabrication Of A Low Dielectric Constant Poly(Arylene Ether Sulfone) Film-Containing Cyclohexane Group

In this study, a novel bisphenol-containing cyclohexane group [4,4'-(cyclohexane-1,1-diyl)bis(2-methoxyphenol) (CDBMP)] was synthesized. It was reacted with 4,4'-dichlorodiphenylsulfone to synthesize polyether sulfone-containing -OCH3 groups (PES-OCH3). Then, PES-OCH3 was reacted with BBr3 and (t-Boc)(2)O to yield PES-OH and PES-Boc, respectively. The glass transition temperatures of PES-OCH3 and PES-OH were found to be 177.6 and 240.7 degrees C, respectively. The resultant resins exhibited good tensile strength and solubility (dissolved in N-Methyl-2-Pyrrolidine, dimethylformamide, and so on). Interestingly, PES-Boc showed excellent foam property, and the density of the foam decreased from 1.23 to 0.012 g/cm(3). Also, we found that the dielectric constant and dielectric loss values (107 Hz) of the foaming sample were in the range of 1.9-2.7 and 4.22 x 10(-3) to 7.99 x 10(-3), respectively. The introduction of hydroxyl-Boc-assisted modification provides a controllable process to fabricate porous and ultra-light materials, and it can be potentially applied in these fields such as microelectronics and high speed communication systems.