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Analysis Of Microchannel Heat Dissipation Characteristics Of Ltcc Microwave Module

Yong Yang,Xuanjun Dai, Qionglian Wei

2019 4TH INTERNATIONAL CONFERENCE ON INTELLIGENT INFORMATION PROCESSING (ICIIP 2019)(2019)

Cited 1|Views3
Key words
LTCC, microchannel, ANSYS, heat dissipation
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