Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface
2019 International 3D Systems Integration Conference (3DIC)(2019)
Abstract
For the first time, this work systematically develops the complete serial link by using hierarchical modeling with serial link power and delay models. This paper presents a comprehensive design methodology and optimization using analytical expressions that analyzes the intrinsic energy and area trade-offs of an inductive coupling based high speed serial link. Further, we also demonstrate that equalization is a potential technique of breaking the intrinsic energy and area trade-offs of a TCI channel and reduces link power consumption and inductor area.
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Key words
TCI channel,intrinsic energy analysis,analytical expressions,proximity communication optimization,inductor area,link power consumption,high speed serial link,inductive coupling,area trade-offs,comprehensive design methodology,delay models,serial link power,hierarchical modeling,contactless 3d ThruChip interface,hierarchical design methodology
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