Optoelectronic Glass Substrates for Co-packaging of Optics and ASICs
OFC(2020)
摘要
A glass packaging substrate with integrated waveguides and evanescent couplers for silicon photonic chiplets is introduced for fiber to chip interconnects with high-channel counts required for co-packaging of optics and switch ASICs in next-generation datacenters. (C) 2020
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关键词
glass packaging substrate,integrated waveguides,evanescent couplers,silicon photonic chiplets,high-channel counts,switch ASIC,optoelectronic glass substrates,fiber-chip interconnects,datacenters
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