2 MB Array-Level Demonstration of STT-MRAM Process and Performance Towards L4 Cache Applications

2019 IEEE International Electron Devices Meeting (IEDM)(2019)

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摘要
In this paper, we discuss array-level MTJ process, performance, and reliability requirements for STT-MRAM operation in an L4 Cache application. We demonstrate 2 MB arrays of scaled-size MTJ devices capable of meeting L4 Cache specifications across all proposed temperatures of operation. The technology achieves ECC-correctable bit fail rates for a 20 ns write time, a 4 ns read time, endurance of 10 12 cycles, and retention of 1 second at 110 C. Key to achieving these results is the careful co-optimization of the MTJ stack and etch process to minimize array-level tail failure events.
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关键词
array-level MTJ process,reliability requirements,STT-MRAM operation,scaled-size MTJ devices,L4 Cache specifications,etch process,array-level tail failure events,array-level demonstration,STT-MRAM process,L4 cache application,ECC-correctable bit fail rates,memory size 2.0 MByte
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