Laser Cutting And Micromachining For Localized And Targeted Solar Cell Characterization

Laser cutting and micromachining can be applied to solar cell materials for processing and characterization applications. An ultrashort pulse (USP) laser with sub-picosecond pulse width can remove material with minimal thermal effects or damage, which is termed 'cold ablation'. Such USP laser cutting and scribing can be implemented for isolating areas within a larger cell while maintaining electrical performance and preventing laser-induced damage and shunting. Laser micromachining has been used to isolate a shunt to improve cell performance and to isolate a small, selected area to define a sample suitable for deep level transient spectroscopy.